Product Description

  • unfilled epoxy laminating system and high-temp board adhesive
  • Tg: 262°F
  • color: amber
  • mixed viscosity: 2,500 cps
  • pot life: 40 min (228 g)

Characteristics and Advantages

  • unfilled
  • non-staining
  • specifically developed for room temperature hardening (B Stage)
  • good room temp curing properties
  • excellent handling properties and fabric wet-out to produce a void free tool with high dimensional stability


  • high temperature board adhesive
  • laminating molds and parts for high temperature applications
  • laminated vacuum form, RIM, and RTM molds
  • spray metal molds
  • compression molds
  • high temperature bonding fixtures